Luminescent Automated Image Processing Hub (LAIPH™)

Based on Luminescent Technologies’ patented Inverse Inspection Technology (IIT), LAIPH is a suite of products designed to increase mask inspection productivity through automation of the defect determination and dispositioning process and eliminate user error. The system incorporates a centralized server which can process data from multiple mask inspection, review, and metrology systems. The robust distributed architecture and job management is scalable to meet any throughput requirement. LAIPH enables the user to examine 193 - 257 nm mask defect images and output DUV scanner aerial images and post-resist wafer images (through incorporation of customer OPC models.), and automatically classify defects into PASS and FAIL. The type of defect and repair are also automatically identified, so that the real defect can be passed to corresponding mask repair tool directly. The end result is that LAIPH substantially reduces mask-defect inspection time for 45-nm, 32-nm, and 22nm integrated circuit (IC) manufacturing.

• Photomask Solutions, LAIPH DUV

  • Mask automatic defect classification, ADC, data sheet (pdf)
  • Lithography plane review, LPR, data sheet (pdf)
  • Aerial image based defect auto disposition, AIA, data sheet (pdf)
  • Reference pattern generation for mask repair, RPG, data sheet (pdf)
  • Wafer CD metrology using mask CD data, WCD, data sheet (pdf)

• EUV Mask Solutions, LAIPH EUV

  • Super fast mask defect (multi-layer and absorber) printability simulation, DPS, data sheet (pdf)

ADC	LPR	AIA
RPG	WCD	DPS

API (Aerial Plane Inspection)

Performs mask inspection defect data analysis and disposition based on Applied Aera2TM and Carl Zeiss AIMS TM mask inspection images. Capabilities include:

• Auto multiple defect detection
• Auto classifying mask patterns into different topologies based on lithography significance and assigning corresponding tolerances, or read the CD spec directly from OPC verification software.
• Auto wafer CD based defect classification based on OPC pattern proximity regions which eliminate operator variability.
• Centralized server to enable incorporation of several inspection systems
• Distributed and scalable hardware for high throughput
• Die to die CD defect analysis of defect image with reference image
• Defocus image analysis capability
• Offline engineering mode analysis
• Available die to database analysis option to create simulated reference aerial image from customer GDS
• User friendly native and Web GUI interface for high productivity

MPI (Mask Plane Inspection)

Performs mask inspection defect data analysis and disposition based on KLA-Tencor 500 series mask inspection images. Capabilities include:

• Auto multi defect detection
• Auto classifying mask patterns into different topologies based on lithography significance and assigning corresponding tolerances, or read the CD spec directly from OPC verification software.
• Auto wafer CD based defect classification based on OPC pattern proximity regions which eliminate operator variability.
• Centralized server to enable incorporation of several inspection systems
• Distributed and scalable hardware for high throughput
• Die-to-die mask defect analysis using Luminescent’s proprietary inverse imaging and forward lithography engine
• Offline engineering mode analysis
• Wafer plane analysis feature with ability to import customer OPC model
• Available die to database analysis option to create simulated reference aerial image from customer GDS
• User friendly native and Web GUI interface for high productivity

Mask Repair

Performs mask pattern rendering of customer reference image to assist in the repair process, in particularly, for single die mask without reference die. Capabilities include:

• Centralized server to enable incorporation of several mask repair systems
• Accurate SEM pattern rendering of reference image from customer provided designs
• Auto image alignment to output reference SEM image to be directly used by mask repair tools
• Distributed and scalable hardware for high throughput
• User friendly Web GUI interface for high productivity